Máy cắt laser phi kim loại Han's Laser FS02-20

ứng dụng：

S035-50 laser scribing machine is widely used in the slicing of monocrystalline silicon, polycrystalline silicon solar battery and silicon wafer in solar industry; and in the cutting of fragile items, some soft metal and non-metal sheet

Model	S035-50
Laser type	YAG
Laser wavelength	1064nm
Max. laser power	50W
Beam quality M2	≤10
Max. positionging speed	150mm/s
Max. cutting speed	120mm/s
Max. cutting depth	0.8mm
Min. line width	0.04mm
Repetition position accuracy	≤0.02mm
Position accuracy	≤±0.02mm
Working area	350×350mm
Power consumption	5kW
Power supply	380V/50Hz/20A
Weight	455kg
Dimension(LxWxH, mm)	1750×1150×720