Ito Group TTAB-1008C/2525A Tabletop Aligner-Bonder With Slide Stage

The Ito Group TTAB-1008C/2525A is a tabletop ACF (anisotropic conductive film) aligner-bonder with a Y-axis slide stage. It is available in both Constant heat and ActiveHeat configurations and is compatiible with Ito Group's Floating Carrier^TM technology, allowing it to be used with complex 3D structures such as camera modules.

The TTAB-1008C/2525A is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. The device can range from a simple flexible printed circuit to a complete display assembly or camera module. After alignment has been completed, the operator slides the stage to the rear of the machine for bonding. Load, unload, and alignment are all performed by the operator. 

 The TTAB-1008C/2525A is recommended for use in FOG, FOB, and FOF assembly and has a recommended minimum pitch of 0.2mm when using a 0.1/0.1mm line/space configuration.

Additional Features:

• HIghly-responsive PID controllers for temperature control.
• Precision air cylinder with digital pressure regulator for fine pressure control.
• Bonding head size: MAX 100x8mm for TTAB-1008CR and MAX 25x25mm for TTAB-2525AR.
• Designed for rapid tooling changeover.
• Floating Carrier^TM capable.

Comprehensive native English manual covering set-up, process development, maintenance, and operation.