Dung Dịch Trợ Hàn Ecofrectm 200

FEATURES

ECOFRECTM 200 is a no clean flux recommended for soldering either with air or nitrogen controlled
atmosphere. Good solder joints without solderballing are achieved with this low residue flux.
ECOFRECTM 200 is compatible with a wide range of solder mask.

SPECIFICATIONS
Density at 20°C: 0,798 - 0.806
Flash point: 16°C
Dry extract, 3 H at 105°C: 2 %
Halogen content: no halide
Acid index: KOH/G mg 18

PROCESS PARAMETERS
ECOFRECTM 200 can exclusively be
applied by spraying, atomisation under
air or nitrogen pressure, or with
ultrasounds.
Preheating temperature must be set so
as to achieve from 120°C to 140° under
the PCB prior to entering the solder
wave, that is 110°C to 130°C on topside
of PCB.
Residue removal, and thus good
cosmetic aspect of PCB will be obtained
through the temperature level achieved
after preheat and solderwave.
Using nitrogen allows for a higher flexibility of use when the application requires to increase preheat
temperature in order to reduce thermal shock, and thus to provide for a better removal of flux residues.
And more especially, the nitrogen atmosphere provides for a significantly better soldering of components,
regardless of their oxidation level.

Liên hệ: 0961170001