Đá Cắt Kim Cuơng - Buehler

Công ty TNHH Thương mại Công nghệ và Kỹ thuật TTS

Địa chỉ: Số 11, ngách 23, ngõ 210, Đội Cấn, Ba Đình, Hà Nội

Hotline: 097.363.1368

Điện thoại: 04 66.748.728               Fax: 04 62.736.175

Email: tts@ttsco.vn

Đá cắt kim cuơng Diamond wafering blades với trục gá đường kính 12.7mm.

1. Standard quality wafering blades for general use.

2. Standard quality wafering blades for hard metals, tungsten carbide, glass and ceramics.

3. High quality wafering blades for aggressive general sectioning of ferrous and non-ferrous materials.

4. High quality wafering blades for routine use, metal matrix composites, PC boards, bone, titanium, thermal spray coatings.

5. High quality wafering blades for use with hard and brittle materials, structural ceramics, glass, electronic substrates, alumina, zirconia, concrete.

6. High quality wafering blades for use with medium to soft ceramics, electronic components, electronic packages, GaAs, AIN, glass fibre reinforced composites.

7. High quality wafering blades for use with hard tough materials, structural ceramics, boron nitride, silicon nitride.

8. High quality wafering blades for use with soft friable ceramics, composites with fine reinforcing media, etc.

9. High quality wafering blades for use with polymers, rubber and other soft gummy materials.